• Come work with us!

    Email your cover letter (a must!) and CV to us!

    Wanted: Mechanical and Thermal Engineer, IC Packaging  

    We are developing novel IC and opto-electronic assemblies which include interesting problems in packaging, assemblies and thermal management. We seek someone to help us work on these technologies. Successful candidates will work with cross-functional teams of IC designers, PCB and embedded designers, Optical Engineers, physicists and even the odd chemist!

     

    Candidates should have a BS or MS in Material or Mechanical Engineering — or equivalent demonstrated practical experience — and at least 5 years of work in mechanical and thermal design of integrated circuit packaging.

     

    Desirable qualifications:

    · State of the art know-how in simulation of IC and package temperature

    · State of the art knowledge in heat dissipation at both the chip level and at the package / PCB level

    · Experience in opto-electronics, MEMS or panel design for the display industry

    · Experience in 3D IC / stacked chip assemblies

    · Some education and experience in micro-fabrication (VLSI, MEMS, etc..)

    · Understanding of chip packaging reliability test condition, criteria and defects

    · Experience and interest in hands-on work in class 100 clean room

     

    PL&H is a venture-backed startup located in Pasadena, CA that has received surprising levels of funding to do seemingly magical things. We offer the usual benefits: competitive salary and stock options, health insurance, 401k with matching, daily lunches, etc. Extraneous interests in plants, jet engines and baking bread are a bonus!

    Email your cover letter and CV to iwanttowork@lightandhologram.com